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This PoP technology enables smaller packages with shorter electrical connections and is supported by companies equivalent to Advanced Semiconductor Engineering (ASE). In embedded PoP techniques, chips are embedded in a substrate on the bottom of the packmature. Using Impacketdocker run -it --rm "impacket:latest"This software is provided under under a alittle modified version ofthe Apache Software License. The package on a package technique tries to combine the benehouses of traditional packaging with the benehouses of die-stacking techniques, while avoiding their drawbacks. A description of a couple of the tools can be found at:www.

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